USB 3.0........Coming soon!

In September 2007 at the Intel's developer forum the concept of USB 3.0 was demonstrated.
USB 3.0 is the newer specification which is to replace the older USB 2.0 h/w specification.
USB 3.0 offers much faster speeds than USB 2.0. It provides Data rates upto 3.2 to 4.8 Gbits/s, which is more than double of the older usb 2.0 specification.
The following details on USB 3.0 are provided by Intel:-

• A new major feature is the SuperSpeed bus, which provides a fourth transfer mode at 4.8 Gbit/s. The raw throughput is 4 Gbit/s, and the specification considers it reasonable to achieve 3.2 Gbit/s (0.4 GByte/s or 400 MByte/s) or more after protocol overhead.^[49]
• When operating in SuperSpeed mode, full-duplex signaling occurs over 2 differential pairs separate from the non-SuperSpeed differential pair. This results in USB 3.0 cables containing 2 wires for power and ground, 2 wires for non-SuperSpeed data, and 4 wires for SuperSpeed data, and a shield (not required in previous specifications).^[50]
• To accommodate the additional pins for SuperSpeed mode, the physical form factors for USB 3.0 plugs and receptacles have been modified from those used in previous versions. Standard-A cables have extended heads where the SuperSpeed connectors extend beyond and slightly above the legacy connectors. Similarly, the Standard-A receptacle is deeper to accept these new connectors. On the other end, the SuperSpeed Standard-B connectors are placed on top of the existing form factor. A legacy standard A-to-B cable will work as designed and will never contact any of the SuperSpeed connectors, ensuring backward compatibility. However, SuperSpeed USB cables, with their extended plugs, will not fit into legacy receptacles.
• SuperSpeed establishes a communications pipe between the host and each device, in a host-directed protocol. In contrast, USB 2.0 broadcasts packet traffic to all devices.
• USB 3.0 extends the bulk transfer type in SuperSpeed with Streams. This extension allows a host and device to create and transfer multiple streams of data through a single bulk pipe.
• New power management features include support of idle, sleep and suspend states, as well as Link-, Device-, and Function-level power management.
• The bus power spec has been increased so that a unit load is 150 mA (+50% over minimum using USB 2.0). An unconfigured device can still draw only 1 unit load, but a configured device can draw up to 6 unit loads (900 mA, an 80% increase over USB 2.0 at a registered maximum of 500 mA). Minimum device operating voltage is dropped from 4.4 V to 4 V.
• USB 3.0 does not define cable assembly lengths, except that it can be of any length as long as it meets all the requirements defined in the specification. However, electronicdesign.com estimates cables will be limited to 3 m at SuperSpeed.^[28]
• Technology is similar to a single channel (1x) of PCI Express 2.0 (5-Gbit/s). It uses 8B/10B encoding, linear feedback shift register (LFSR) scrambling for data and spread spectrum. It forces receivers to use low frequency periodic signaling (LFPS), dynamic equalization, and training sequences to ensure fast signal locking.

USB 3.0 is expected to be implemented in PC's by the end of 2010.